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eMCP
 
ADATA embedded Multi-chip package (eMCP) memory configurations are designed to support a growing list of device capabilities, expanding freedom and choice for users who want to do more with their mobile applications. ADATA eMCP combine different memory technologies, including MLC NAND Flash or eMMC and LPDDR2 (low-power DDR2) on a single substrate. Contact Us

Flash Storage Product Development Dept.
Tel: +886-2-8228-0886
 
Model ADATA eMCP
Picture
Interface 162 Ball FBGA
JEDEC Standard eMMC 4.41/4.5
Capacity 4GB+4Gb/4GB+8Gb/8GB+8Gb
Operating Voltage

VCCQ 2.7~3.6; 1.7~1.95

VCC 2.7~3.6

Flash Type MLC
Sequential Read (Max.) up to 40MB/s
Sequential Write (Max.) up to 9 MB/s
Operating Temperature -25℃ to 85℃
Storage Temperature -40℃ to 85℃
Power consumption (max.) 4.41(95mA) / 4.5 (70mA) Only Controller
Error Correction Code 40bit / 1KB (V4.41)/72bit/1KB (V4.5)
Dimension (LxWxH/T)

Min 11.5 x 13 x 1.0(mm) Max 11.5x13x1.2(mm)

Min 12x16x1.0(mm) Max 12 x 16 x 1.2(mm)

Application Smart phone/Feature Phone

 

 
 
 
 
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