The hottest topic of 2024 has been &ldquo;high-speed AI computing.&rdquo; However, the public&rsquo;s attention is also focused on the "heat dissipation&rdquo; aspect of AI computing. Although seemingly unrelated topics, there is in fact an inseparable relationship between high-speed computing and heat dissipation. For electronic products, heat management means ensuring operational stability. Poor heat dissipation will cause components to overheat and cause product damage. Good heat dissipation can significantly reduce failure rate. Especially in terms of <a href="https://www.adata.com/us/news/1120/" target="_blank" rel="noopener">overclocked memory</a>, as clock speed rises, it becomes more likely that operating temperature exceed tolerances, which poses a challenge to system stability, performance, and reliability. Therefore, cooling solutions are becoming more and more important in electronic products. Memory heatsinks are limited by motherboard space and cannot exceed a certain volume. Therefore, applying <a href="https://www.adata.com/us/news/1120/" target="_blank" rel="noopener">heat dissipating coating technology to PCBs (printed circuit boards)</a> is an innovative solution for overclocked memory.

Firstly, to understand PCB thermal coating technology, one must first understand the basic principles of heat dissipation. Currently, there are four primary methods of heat dissipation:
&nbsp;
<ol>
<li>Thermal convection: Heat dissipation using fans, often used in desktop computers or laptops.</li>
<li>Thermal conduction: Use materials such as graphene to disperse heat evenly.</li>
<li>Thermal radiation: Dissipate heat through radiation.</li>
<li>Liquid-cooling: Categorized into liquid cooling and immersion cooling, liquid cooling usually uses non-conductive liquid or water. Heat energy is transferred to the liquid through a heat conductor and then heat energy in the liquid is expelled by a fan. This cycle is repeated to achieve heat dissipation. Immersion cooling is usually used in servers. The server is immersed in a non-conductive liquid and heat energy is transmitted through direct contact and liquid flow. High temperature liquid cools through circulation and continues to absorb heat.</li>
</ol>

Basic principles of heat dissipation

Revolutionary thermal coating technology promotes PCB heat dissipation without changing the manufacturing process. The optimized heat dissipating solder mask layer not only insulates, but also provides excellent heat dissipation stability and radiation effects. It cools through radiative heat dissipation during the heat conduction process. These characteristics allow the solder mask ink to evolve from a thermally resistant material to a heat dissipating material. In addition, domestic and foreign scholars have found that thermal radiation will produce thermal radiation resonance at the same electromagnetic radiation frequency, which can effectively discharge more heat and provide more cooling alternatives for electronic products.

Advantages and applications of thermal coating technology

▲ Heat dissipating solder mask ink distribution on PCB board

Real-world testing has proven that <a href="https://www.adata.com/us/news/1120/" target="_blank" rel="noopener">PCB heat dissipating coating technology</a> can significantly increase heat dissipation area, improve efficiency, and lower memory module heat energy generation when running at high clock speeds. This technology improves memory module cooling efficiency by up to 10% without changing the manufacturing process. The successful application of this technology not only promotes the development of memory overclocking, but also creates a new opportunity for the application of <a href="https://www.adata.com/us/news/1120/" target="_blank" rel="noopener">memory cooling technology in the AI industry</a> moving forward.

Test results

▲ Thermal imaging camera shows differences in overclocked LANCER NEON RGB 8,000MT/s temperatures with and without heat dissipating coating

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The hottest topic of 2024 has been “high-speed AI computing.” However, the public’s attention is also focused on the "heat dissipation” aspect of AI computing. Although seemingly unrelated topics, there is in fact an inseparable relationship between high-speed computing and heat dissipation. For electronic products, heat management means ensuring operational stability. Poor heat dissipation will cause components to overheat and cause product damage. Good heat dissipation can significantly reduce